1. ¹èÄ¡ (Placement)
- PCB Á߽ɺΠȤÀº Á¢Áö stitch À§Ä¡(»þ½ÃÁ¢Áö)¿¡ ¹èÄ¡ÇÑ´Ù. - Ŭ·°ÀÌ ´Ù¸¥ ÀåÄ¡·Î °£´Ù¸é, Ŭ·° Æ®·¹À̽º¸¦ Á¾´Ü°ú ÇÔ²² »óÈ£ ¿¬°á¿¡¼ ¸Ö¸® ¹èÄ¡Ç϶ó - PCB À§¿¡ Á÷Á¢, Å©¸®½ºÅаú ¹ßÁø±â¸¦ À§Ä¡ÇÏ°í, ¼ÒÄÏÀ» »ç¿ëÇÏÁö ¸¶¶ó - Ŭ·° ¿µ¿ª¿¡¼´Â Ŭ·°È¸·Î¿Í °ü·Ã Æ®·¹À̽º¸¸ ¹èÄ¡Ç϶ó - Ŭ·°È¸·Î Àüü¸¦ 100% ¿¡¿ö ½Ò ¼ö ÀÖ´Â Æз¯µ¥ÀÌ cage¸¦ »ç¿ëÀ» Çã°¡Ç϶ó. - Ç×»ó ¹ßÁø±â ¸ðµâÀÇ ±Ý¼Ó ÄÉÀ̽º¸¦ Á¢Áö½ÃÅ°´Â ºÎ°¡ÀûÀÎ Àü¿øÀ» Á¦°øÇ϶ó.
2. ÀÓÇÇ´ø½º Á¦¾î (Impedance Control)
- ¸¶ÀÌÅ©·Î½ºÆ®¸³ ±¸Á¶¿Í ½ºÆ®¸³ ±¸Á¶°¡ ÀÖ°í, ÆÐÅÏÀÇ ÀÓÇÇ´ø½º¸¦ °è»êÇÏ¿© »ç¿ëÇÑ´Ù.
- ÇÁ·Î±×·¥»ó¿¡¼µµ °è»êµÉ ¼ö ÀÖ´Ù.
- ÀϹÝÀûÀ¸·Î Ŭ·° ÀÓÇÇ´ø½º´Â 55~75 Á¤µµ »ç¿ëÇÑ´Ù.
3. µðÄ¿Çøµ (Decoupling)
- Ŭ·°È¸·Î ºÎÇ°Àº Äܵ§¼¸¦ ÀÌ¿ëÇÏ¿© RF µðÄ¿ÇøµÇØ¾ß ÇÑ´Ù. : Àü¿ø°ú Á¢Áö °£ÀÇ ½ºÀ§Äª ¿¡³ÊÁö·Î ÀÎÇÏ¿© RF ÀâÀ½ÀÌ ´Ù¸¥ ȸ·Î¿¡ ¿µÇâÀ» ÁÙ ¼ö ÀÖ´Ù.
- ¼±ÅõǾîÁø Äܵ§¼ÀÇ Àڱ⠰øÁø ÁÖÆļöÀº Ŭ·° °íÁ¶ÆÄ º¸´Ù ´õ ³ô¾Æ¾ß ÇÑ´Ù. : 2ns ÀÌÇÏÀÇ ¿¡Áö ·¹ÀÌÆ®¿¡¼´Â 10~30MHz ¹üÀ§ÀÇ Àڱ⠰øÁø ÁÖÆļö¸¦ °®Àº Äܵ§¼¸¦ ¼±ÅÃÇÑ´Ù. : ÀϹÝÀûÀ¸·Î PCB´Â 200~400MHz¿¡¼ Àڱ⠰øÁøÀ» ÀÏÀ¸Å²´Ù.
- ¸ðµç Ŭ·° ¿µ¿ª¿¡¼ ¹ÙÀÌÆнº Äܵ§¼ »Ó¸¸¾Æ´Ï¶ó, Ç×»ó ÀûÀýÇÑ °íÁ¶ÆÄ RF µðÄ¿Çøµ Äܵ§¼¸¦ »ç¿ëÇÑ´Ù. : ÀüÇØ Äܵ§¼´Â °íÁ¶ÆÄ µðÄ¿Çøµ¿¡ ºñÈ¿À²ÀûÀ̳ª, Àü·Â¼± ÇÊÅÍ¿¡´Â ÃÖÀûÀÌ´Ù. : µðÄ¿Çøµ Äܵ§¼´Â ÁÖ·Î ¸ð³ëÅä´Ð-Äܵ§¼, ¼¼¶ó¹Í-Äܵ§¼¸¦ ÁÖ·Î »ç¿ëÇÑ´Ù.
- ÀϹÝÀûÀ¸·Î, Ŭ·° ÁÖÆļö¿¡ ´Ù¼¸ ¹ø° °íÁ¶Æĸ¦ °í·ÁÇÑ´Ù.(±× º¸´Ù ³ôÀº °øÁø ÁÖÆļö¸¦ °®´Â Äܵ§¼ ¼±ÅÃ)
4. Æ®·¹À̽º ±æÀÌ (Trace Length)
Ŭ·°½ÅÈ£ÀÇ ·¹À̾ƿô ¹æ¹ý 1) ÃÖ¼Ò ±æÀÌÀÇ Æ®·¹À̽º ±æÀÌ 2) ÃÖ¼ÒÀÇ ºñ¾Æ »ç¿ë 3) I/O ¿µ¿ª¿¡ ÀÎÁ¢½Ãų °æ¿ì¿¡´Â ±â´É¼º ºÐÇÒÀ» ½ÃµµÇ϶ó. 4) ¸ðµç Ŭ·° ¼±À» ª°ÔÇÑ´Ù. 5) ±æ¾îÁú °æ¿ì¿¡´Â Àü¼ÛÀÌ·ÐÀ» »ç¿ëÇÏ¿© ¹Ý»ç°¡ ÀϾÁö ¾Êµµ·Ï Å͹̳×ÀÌ¼Ç ÇÑ´Ù.
5. ¹è¼± Ãþ (Routing Layers)
- Ŭ·°°ú Áֱ⼺ ½ÅÈ£´Â ÇϳªÀÇ Æò¸éÀ̳ª ´ÜÀÏ ¿µ»ó Æò¸é(À̹ÌÁö Ç÷¹ÀÎ)À» °¡Á®¾ßÇÑ´Ù.
- °æ·ÎÃþ ¼±ÅÃÇÒ °æ¿ì, °í·ÁÇؾßÇÒ »çÇ× 1) Æ®·¹À̽º °æ·Î ¼³Á¤(¾î¶² Ãþ »ç¿ëÇÒ °ÍÀΰ¡) 2) ¼³°èÃþ »çÀÌÀÇ Jumping 3) ÀÏÁ¤ÇÑ Æ®·¹À̽º ÀÓÇÇ´ø½º À¯Áö - °æ·Î ¼³Á¤ Ãþ - Ãþ Jumping : ºñ¾Æ »ç¿ë
6. Å©·Î½º ÅäÅ© (Crosstalk)
- ³ª¶õÇÑ ÆÐÅÏ°£ÀÇ ±â»ý ÀδöÅϽº¿Í ±â»ý Ä¿ÆнÃÅϽº¿¡ ÀÇÇØ ½ÅÈ£°¡ °áÇյǴ Çö»óÀÌ´Ù.
- Ŭ·°»Ó¸¸ ¾Æ´Ï¶ó µ¥ÀÌÅÍ, ¾îµå·¹½º, Á¦¾î ½ÅÈ£¿¡µµ »ý±æ ¼ö ÀÖ´Ù. ½ÅÈ£ Ç°Áú¿¡µµ ¹®Á¦¸¦ ÁÖÁö¸¸, EMIÀÇ ÁÖ ¿øÀÎÀÌ´Ù.
- ³ª¶õÇÑ Æ®·¹À̽º ±æÀ̸¦ ÃÖ¼ÒÈÇÏ°í, ³ª¶õÇÑ Æ®·¹À̽º´Â ÃÖ¼ÒÇÑ 3W ±ÔÄ¢À» ÁöŲ´Ù.
- Å©·Î½º ÅäÅ© °è»ê
¹æ¹ý1) ´ÜÀ§ : dBx, ±âÁØ°ª : °£¼·È¸·Î¿¡¼ °£¼· ¹ÞÀº ȸ·Î±îÁö 90dB ¼Õ½Ç dBx = 90 - (dB·Î Ç¥ÇöµÈ ´©È°áÇÕ ¼Õ½Ç)
7. ºÎÇ° (Components)
- ÁÖÆļö »ý¼º ºÎÇ°Àº ½Ã½ºÅÛÀÇ Å¸ÀÌ¹Ö ¸ñÀûÀ¸·Î¸¸ »ç¿ë - »ç¿ëÇÏÁö ¾ÊÀº ÇɵéÀº Á¾´Ü ȤÀº ±×¶ó¿îµå, Á¢Áö¿¡ Á¢¼ÓÇÏ¿© ¹«È¿È ½ÃŲ´Ù. - ±¹ºÎ Á¢ÁöÆÇ »ç¿ë : ¹ßÁø±â Á¢Áö ÇÉÀº RF Àü·ù¸¦ Á¢Áö ½Ãų ¼ö ÀÖ´Ù. - 90µµ ¹è¼±±ÝÁö - ´ÜÃþ, ¾ç¸é PCB¿¡¼´Â °¡À̵带 »ç¿ë = ´Ù¸¥ Æ®·¹À̽º¿Í Å©·Î½º Ʈũ¸¦ ¸·¾ÆÁØ´Ù. = ȸ±Í Àü·ù °æ·Î¸¦ Á¦°øÇÑ´Ù. = ÃÖ¼ÒÀÇ ½ÅÈ£-ȸ±Í ·çÇÁ ¿µ¿ªÀ» Á¦°øÇÑ´Ù.
8. Æ®·¹À̽º ºÐ¸®¿Í 3-W ±ÔÄ¢ (Trace Separation and the 3-W Rule)
- Àû¿ë´ë»ó = Ŭ·°, Áֱ⼺ ½ÅÈ£(µ¥ÀÌÅÍ ¹ö½º, ¾îµå·¹½º ¹ö½º, Á¦¾î ½ÅÈ£, I/O ½ÅÈ£) = Â÷µ¿ pair ½ÅÈ£¿¡¼µµ 3-W ±ÔÄ¢À» »ç¿ëÇÏ´Â °ÍÀÌ ÁÁ´Ù. (LVDS)
- 3-W ±ÔÄ¢ : 70%ÀÇ ¼±¼Ó ÇÑ°è = Æ®·¹À̽º °£°ÝÀº Æ®·¹À̽º ÆøÀÇ 2¹è ÀÌ»ó ¶ç¿ö ÁÖ¾ß ÇÑ´Ù. Áï, ȸ±Í Àü·ù ¼± Æø(Image Plane)Àº Æ®·¹À̽º ÆøÀÇ 3¹è°¡ µÇ´Â °ÍÀÌ´Ù.
- 3-W ±ÔÄ¢ ÀÌÁ¡ = Æ®·¹À̽º°£ÀÇ ½ÅÈ£ °áÇÕÀ» ÃÖ¼ÒÈ = ½ÅÈ£ ÀÚ¼Ó°ú ȸ±Í ÀÚ¼Ó°£ÀÇ ÀûÀýÇÑ ¼Ò°Å¿¡ ÀÇÇؼ ÀÚ¼ÓÀÇ ¿äµ¿ÀÌ ¾ø¾îÁø´Ù. = Æ®·¹À̽º »çÀÌÀÇ Å©·Î½º ÅäÅ© Çö»óÀ» °¨¼Ò ½ÃŲ´Ù.
- 10-W ±ÔÄ¢ : 98%ÀÇ ¼±¼Ó ÇÑ°è
****** Âü°í ¹®Çå (References)****** 1) Mottrose, M. 1999. EMC and the Printed Circuit Board Design-Design, Theory and Layout Made Simple. Piscataway, NJ: IEEE Press. 2) Kaupp, H.R. 1967, April. "Characteristics of Mocrostrip Transmission Lines: IEEE Transactions." Vol. EC-16, No. 2. 3) National Semiconductor. 1996. LVDS Owner''s Manual. 4) IPC-D-317A. 1995, January. Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques. Institute for Interconnecting and Packaging Electronics Circuits. 5) IPC-2141.1996, April. Controlled Impedance Circuit Boards and High Speed Logic Design. Institute for Interconnecting and Packaging Electronics Circuits. 6) Paul, C. R. 1984. Analysis of Multiconductor Transmission Lines. New York: John Wiley & Sons. 7) Paul, C. R. 1992. Introduction to Electromagnetic Compatibility. New York: John Wiley & Sons. 8) Mardiguian, M. 1992. Controlling Radiated Emissions by Design. New York:: Van Nostrand Reinhold. 9) Motorola, Inc. Transmission Line Effects in PCB Applications(#AN1051/D) 10) Johnson, H.W., and M.Graham. 1993. High Speed Digital Design. Englewood Cliffs, NJ: Prentice Hall.
Old - 1''st Edition 1) Mardiguian, M. 1992 Controlling Radiated Emission by Design. New York: Van Nostrand Reinhold. 2) Mororola, Inc. MECL System Design Handbook (#HB205) and Transmission Line Effects in PCB Applications (#AN1051) 3) Mororola, Inc. Transmission Line Effects in PCB Applications (#AN1051/D) 4) Dockey, R.W. and R.F. German. 1993. New techniquies for reducing PCB common-mode radiation. Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: New York: IEEE, 344-339
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