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Minimum Outer Line Width .005" .0035"
Minimum Inner Line Width .004" .003"
Minimum Outer Space, Trace/Trace .005" .0035"
Minimum Inner Space, Trace/Trace .004" .003"
Minimum Space, PCB Edge to Conductor .010" .008"
Layer-to-Layer Registration +/-.005" +/-.004"
Maximum Finished PCB Thickness .190" .265"
Board Thickness Tolerance +/- 10% +/- 5%
Dimensions-Hole Location(<12" Finished Board)
Dimensions-Hole Location(>12" Finished Board)
+/-.003"
+/-.004"
+/-.0025"
+/-.003"
Dimensions-Fab O.D. .008" .005"
Warpage(inch per inch)(flatness of finished board) .008" .006"
Minimum Component Pitch .020" .010"
Minimum Dielectric Thickness .004" .002"
Maximum Number of Layers 20 52
Minimum Hole Size .008" .005""
Maximum Drill Size .250" .257"
Tolerance-Plated Hole Size +/-.003" +/-.002"
Drill To Copper .007" .004"
Maximum Aspect Ratio 12:1 18:1
SMT Minimum Pad Spacing .006" .004"
Minimum Soldermask Dam .004" .003"
HASL    
Immersion Silver    
PreFlux    
Immersion Ni/Au    
Immersion White Tin    
Electrolytic Hard Gold